Features:
- Two kinds of RD connector models for choice: MMCX & UFL type
- Single-Chip 802.11a/b/g mini-PCI Design for Embedded Application
- High Power Design, average power up to 25dBm
- Hear sink design provide reliable high power RD performance
- Screw hole reserved for assembly with AP main board
- Integrated 802.11i/WPA2 Supplicant - 802.11e Compatible Bursting
- Internal Low Frequency Oscillator for Low Power Sleep Mode
- Host Interface PCI 2.3 Compatible
- WHQL Certified
- RoHS Compliant
- Operating Temp. Range can reach fm -40oC to 80oC
- Industrial Spec. (optional)
Specifications:
|
Frequency Band |
A Mode: 5.15~5.35 & 5.725~ 5.85 GHz for US
5.15~5.35 GHz for Japan
5.15~5.35 & 5.47~5.725 GHz for ETSI
5.725~5.85 GHz for China
4.94~4.989Ghz for US safety band
B/G Mode: 2400~2483.5 MHz (for US, Canada, EU, China and Japan) |
|
Modulation Technique |
802.11 a/b/g
DSSS (DBPSK, DQPSK, CCK)
OFDM (BPSK,QPSK, 16-QAM, 64-QAM) |
|
Host interface |
Mini-PCI type 3A |
|
Channels support |
802.11b/g US/Canada: 11 (1 ~ 11)
Major European country: 13 (1 ~ 13)
France: 4 (10 ~ 13)
Japan: 11b: 14 (1~13 or 14th), 11g: 13 (1 ~ 13)
802.11a US/Canada: 12 non-overlapping channels
Europe: 19 non-overlapping channel
Japan: 8 non-overlapping channels
US(safety band) : 4940~4990Mhz |
|
Operation voltage |
3.3V +/- 10% |
|
Power consumption |
A Mode: Cont. Tx: 1100mA (typical)~1300mA (max)
Cont. Rx: 250mA (typical)~270mA (max)
Stand by: 280mA (typical)~290mA (max)
B Mode: Cont. Tx: 730mA (typical)~780mA (max)
Cont. Rx: 200mA (typical)~220mA (max)
Stand by: 230mA (typical)~240mA (max)
G Mode: Cont. Tx: 730mA (typical)~780mA (max)
Cont. Rx: 240mA (typical)~260mA (max)
Stand by: 280mA (typical)~290mA (max)
Power saving: 35mA (typical)~55mA (max)
Radio off: 40mA (typical)~50mA (max) |
|
Output power |
A Mode:
+22.5dBm at 6, 9, 12, 18Mbps
+21.5dBm at 36Mbps
+19dBm at 48Mbps
+18dBm at 54Mbps
B Mode:
+24.5dBm at 1,2, 5.5, and 11Mbps
G Mode:
+24.5dBm at 6, 9, 12, 18Mbps
+23.5dBm at 36Mbps
+22dBm at 48Mbps
+21dBm Bm at 54Mbps |
|
